EFP140 Photoimageable Soldermask
Description:
EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.
Excellent flexibility.
Fine solder-dam resolution (50µm, 2mil).
Resistant to multiple soldering operations.
Resistance to Pb-Free, ENIG & Sn Processes.
RoHS compliant and Halogen-Free.
RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
- EFP140/4121 BR AS - SDS20365
- Max file size:246 KB
- File type:PDF
- EFP140/3840 N - SDS11429
- Max file size:247 KB
- File type:PDF
- EFP140/3856W - SDS20346
- Max file size:247 KB
- File type:PDF
- EFP140/3844T - SDS11428
- Max file size:202 KB
- File type:PDF
- EFP140/3044 BR - SDS10667
- Max file size:247 KB
- File type:PDF
- EFP140/6152 Br - SDS20949
- Max file size:-
- File type:-
- EFP140/5991 T (silicone free) - SDS20753
- Max file size:315 KB
- File type:PDF
- EFP140/6072 Br - SDS20866
- Max file size:234 KB
- File type:PDF
To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com