EFP140 Photoimageable Soldermask


EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50µm, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.

Technical Data Sheet:

File size:219 KB
File type:PDF
Click to download:Download
EFP140/4121 BR AS - SDS20365
Max file size:246 KB
File type:PDF
EFP140/3840 N - SDS11429
Max file size:247 KB
File type:PDF
EFP140/3856W - SDS20346
Max file size:247 KB
File type:PDF
EFP140/3844T - SDS11428
Max file size:202 KB
File type:PDF
EFP140/3044 BR - SDS10667
Max file size:247 KB
File type:PDF
EFP140/6152 Br - SDS20949
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EFP140/5991 T (silicone free) - SDS20753
Max file size:315 KB
File type:PDF
EFP140/6072 Br - SDS20866
Max file size:234 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com