EFP140 Photoimageable Soldermask

Description:

EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50µm, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.