Electrabond is a single component, solvent-free, silver-filled, epoxy curing system designed for use as a die attach adhesive.
Electrabond viscosity and rheological characteristics are optimised for effective, fast dispensing without stringing, tailing or resin bleed. The solvent-free formulation reduces weight loss and eliminates the risk of voids

Technical Data Sheet:

File size:133 KB
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Electrabond 3 - SDS10442
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