EFP140 LDI Direct Image Photoimageable Soldermask

Description:

EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50?m, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.

Technical Data Sheet:

EFP140 LDI
File size:471 KB
File type:PDF
Click to download:Download
EFP140/5644 G LDI - SDS20285
Max file size:149 KB
File type:PDF
EFP140/5745 T AS DI - SDS20393
Max file size:143 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com

EFP140 Photoimageable Soldermask

Description:

EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50µm, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.

Technical Data Sheet:

EFP140
File size:219 KB
File type:PDF
Click to download:Download
EFP140/4121 BR AS - SDS20365
Max file size:246 KB
File type:PDF
EFP140/3840 N - SDS11429
Max file size:247 KB
File type:PDF
EFP140/3856W - SDS20346
Max file size:247 KB
File type:PDF
EFP140/3844T - SDS11428
Max file size:202 KB
File type:PDF
EFP140/3044 BR - SDS10667
Max file size:247 KB
File type:PDF
EFP140/6152 Br - SDS20949
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EFP140/5991 T (silicone free) - SDS20753
Max file size:315 KB
File type:PDF
EFP140/6072 Br - SDS20866
Max file size:234 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com

Ronascreen 1300 Series Flexible Coverlay

Description:

Ronascreen 1300 Series of UV curable inks are formulated for use as covercoats on polyester based flexible printed circuits and membrane switches. The inks are widely used for automotive printed wiring applications and are approved by many car producers and component suppliers. The inks are polymerised by exposure to ultraviolet light giving exceptionally flexible films with good adhesion to copper and base laminate.

1301 General purpose products for flexible circuits.
1305 Recommended where circuits are subjected to mass soldering techniques.

• Screen-print characteristics are developed and controlled using computerized rheology equipment. Products optimised for high-speed reel-to-reel printing (3000 prints per hour) or flat-bed printing to extremely tight tolerances.

• 100% solids formulation means there is no solvent to evaporate, 1300 Series will not dry in the screen, allowing continuous long runs and the elimination of mid-shift clean-ups. 100% solids allow excellent track coverage.

• 1300 Series print characteristics allow excellent track encapsulation and fill, avoiding skips and/or micro bubbles.

Technical Data Sheet:

Ronascreen 1300 series
File size:126 KB
File type:PDF
Click to download:Download
Ronascreen 1301 - SDS11234
Max file size:225 KB
File type:PDF
RONASCREEN 1305 UV flexible covercoat - SDS10866
Max file size:235 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com