EFP140 LDI Direct Image Photoimageable Soldermask
Description:
EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.
Excellent flexibility.
Fine solder-dam resolution (50?m, 2mil).
Resistant to multiple soldering operations.
Resistance to Pb-Free, ENIG & Sn Processes.
RoHS compliant and Halogen-Free.
RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
- EFP140/5644 G LDI - SDS20285
- Max file size:149 KB
- File type:PDF
- EFP140/5745 T AS DI - SDS20393
- Max file size:143 KB
- File type:PDF
To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com