EFP140 LDI Direct Image Photoimageable Soldermask
EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.
Fine solder-dam resolution (50?m, 2mil).
Resistant to multiple soldering operations.
Resistance to Pb-Free, ENIG & Sn Processes.
RoHS compliant and Halogen-Free.
RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
Technical Data Sheet:
- EFP140 LDI
- File size:471 KB
- File type:PDF