ED2000 Thermal Cure Silver Paste for Rigid Substrate
ED2000 series of silver pastes are highly conductive (35 milliOhms per square), silver-filled, thermosetting conductor materials suitable for use on rigid substrate. They can be used for printing through-hole, complete circuits or providing “jumper” connections on conventional circuits where high conductivity is required. They have a hard wearing surface suitable for use as sliding contacts.
Technical Data Sheet:
- File size:113 KB
- File type:PDF