ED2000 Thermal Cure Silver Paste for Rigid Substrate
Description:
ED2000 series of silver pastes are highly conductive (35 milliOhms per square), silver-filled, thermosetting conductor materials suitable for use on rigid substrate. They can be used for printing through-hole, complete circuits or providing “jumper” connections on conventional circuits where high conductivity is required. They have a hard wearing surface suitable for use as sliding contacts.
- ED2000/3167 - SDS10515
- Max file size:143 KB
- File type:PDF
- ED2000 - SDS10474
- Max file size:142 KB
- File type:PDF
To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com