Electrabond is a single component, solvent-free, silver-filled, epoxy curing system designed for use as a die attach adhesive.
Electrabond viscosity and rheological characteristics are optimised for effective, fast dispensing without stringing, tailing or resin bleed. The solvent-free formulation reduces weight loss and eliminates the risk of voids
Technical Data Sheet:
- File size:133 KB
- File type:PDF