WLP60 is a liquid, photoimageable two component photodielectric/soldermask designed for use on high definition CSP/WLP Packages. It has a long track record of use in WLP applications where final components must pass stringent High Temperature Storage (2000 hours at 150°C), Thermal Cycling (1000 cycles -40°C to 125°C) and Moisture Sensitivity (2000 hours 85°C/85% RH) tests. Versions are available for application by screen printing and spin-coat.
Excellent resolution and side-wall profile control.
Compatible with lead-free processing.
Suitable for electrolytic/electroless gold plating.
Thermal cycling & crack resistance.
Suitable for high temperature storage.
12 month shelf-life.
Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
WLP 4478 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 40um.
Fast exposing less than 250mJ/cm2 for sub-10um layers.
Resolution capability down to 15 um line and space.
Optimum properties achieved by low temperature 150°C cure.
Processed by non-proprietary aqueous chemistry.
Ambient storage, 12 month shelf life.
WLP SH32-1-1 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 40um.
Fast exposing less than 250mJ/cm2 for sub-10um layers.
Resolution capability down to 15 um line and space.
Optimum properties achieved by low temperature 150°C cure.
Processed by non-proprietary aqueous chemistry.
Ambient storage, 12 month shelf life.
ER7 Photodielectric developer has been specially formulated for non-aqueous development of photo-defined passivators and dielectrics. ER7 is supplied ready to use and the chemical make-up designed to provide residue free development.
A range of package sizes are available, with or without installed dip-tubes for contamination-free handling.
EP3912 forms a high humidity and high temperature resistant coating. It offers protection against metal plating processes and subsequent Pb-free assembly of the final package.
It can be applied by screen-printing although formulations for other application methods (air-spray and spin-coat) are available.
EP3912 It is normally used as a barrier layer underneath the solvent soluble, photo-definable die-passivator, EP2793.
EP3912 forms a high humidity and high temperature resistant coating. It offers protection against metal plating processes and subsequent Pb-free assembly of the final package.
It can be applied by screen-printing although formulations for other application methods (air-spray and spin-coat) are available.
EP3912 It is normally used as a barrier layer underneath the solvent soluble, photo-definable die-passivator, EP2793.
ELX-ITO-R is a partially transparent, conductive paste optimised for use as an alternative to ITO in electro luminescent (EL) lamp and printed electronics applications.
It is formulated to give excellent adhesion performance to both polycarbonate and polyester films.
ELX50 is a conductive carbon based paste optimised for use as a rear electrode in the construction of electro
luminescent (EL) lamps.
It is formulated to give a crack free layer with excellent adhesion performance with ELX80 Dielectric Paste and
ELX40 UV Curable Coverlay.
ELX40 is a range of coverlay materials used to provide electrical insulation and protection of electro
luminescent (EL) lamps.
ELX40 is formulated to give excellent adhesion performance with ELX30 Silver
Conductor Paste
ELX30 is a conductive silver based paste optimised for use in the construction of electro luminescent (EL) lamps
ELX30 is a conductive silver based paste optimised for use in the construction of electro luminescent (EL) lamps
A screenable UV curable solder mask, specifically formulated for use in the high speed production of copper only PCBs. The product is fast-curing, suitable for use on semi-automatic and fully automatic printing equipment and is resistant to bleed. Ronascreen 1600 series inks exhibit good adhesion and resistance soldering processes.
Surface hardness 4H Pencil
Adhesion on copper 100/100 Cross-hatch test
Water absorption 0.2% maximum
Surface resistivity 1 x 1014 ohms
Volume resistivity 1 x 1016 ohms cm2/cm
Dielectric constant 1.5 (1 MHz)
Dissipation factor 0.02 (1 MHz)
Dielectric strength 60v/micron
UL Approved flammability class 94 V-O
Ronascreen 1400/5160 Flex is a blue, acid resistant, flexible etch resist for use on flexible PCBs, membrane switches and printed electronics. Suitable as a resist over a number of substrates including copper, aluminium and ITO, it is rapidly stripped by solutions of alkali hydroxides or strong organic bases.
Ronascreen 1400/5160 is formulated to allow high squeegee speeds and cure rates with NO compromise on print definition, etch resistance or ease of stripping.
Highly flexible, crack resistant film.
Easy and fast stripping in sodium hydroxide as well as organic bases suitable for aluminium.
Optimise viscosity and thixotropic index to give well defined print features.
Ronascreen 1400 etch resists are formulated to resist attack by acidic and ammoniacal etchants up to pH 9.5. Ronascreen 1400 is rapidly stripped by dilute sodium hydroxide and the resulting solution does not block filters or interfere with the operation of re-cycling systems.
Cured films are easily stripped into fine particles by a range of inorganic and organic bases.
Fast, low energy curing gives a dry surface permitting PCBs to be stacked without “blocking”.
Strong colour gives good contrast against the metallic substrates for easy inspection.
A range of viscosity and thixotropic index values are available to suit all printing requirements.
Ronascreen 1300 Series of UV curable inks are formulated for use as covercoats on polyester based flexible printed circuits and membrane switches. The inks are widely used for automotive printed wiring applications and are approved by many car producers and component suppliers. The inks are polymerised by exposure to ultraviolet light giving exceptionally flexible films with good adhesion to copper and base laminate.
1301 General purpose products for flexible circuits.
1305 Recommended where circuits are subjected to mass soldering techniques.
Screen-print characteristics are developed and controlled using computerized rheology equipment. Products optimised for high-speed reel-to-reel printing (3000 prints per hour) or flat-bed printing to extremely tight tolerances.
100% solids formulation means there is no solvent to evaporate, 1300 Series will not dry in the screen, allowing continuous long runs and the elimination of mid-shift clean-ups. 100% solids allow excellent track coverage.
1300 Series print characteristics allow excellent track encapsulation and fill, avoiding skips and/or micro bubbles.
ETP240 is a contact exposure, negative working photoimageable etch resist, formulated for roller or dip coating as a cost effective alternative to dry film-resist in the manufacture of high density multi-layer PCBs.
After acid etching it is easily removed in a sodium hydroxide solution or proprietary resist strippers.
<25µm (1 mil) resolution capability.
Fast drying speed for high through-put production
Hard tack-free surface after drying allowing layers to be 75° stacked without blocking.
Excellent adhesion and conformance to copper surfaces.
High acid etch resistance.
Roller or dip coat
ETAP240 is a contact exposure, negative working photoimageable etch and plate resist, formulated for use as a cost effective alternative to dry film-resist in the manufacture of high density multi-layer PCBs.
It can be applied by air-spray or screen-printing and is suitable for use with alkali and acid etchant solutions and plating solutions. After etching or plating it is easily removed in a sodium hydroxide solution or proprietary resist strippers.
<25µm (1 mil) resolution capability.
Excellent adhesion and conformance to copper surfaces.
High acid & alkali etch resistance.
Screen print, spray, dip or roller-coat.
ETA 24 is a versatile Etch/Plating Resist used on high volume Print and Etch PCBs. Suitable for use with alkali Etchants in the pH range 8.0 to 9.5 it can also be used as an acid etch resist. ETA24 is an excellent Plating Resist, capable of withstanding up to 40 amperes and high pH solutions above a pH of 8.0.
Excellent print definition on hand, semi and fully automatics print formats.
Fast clean stripping.
High acid and alkali resistance.
Versions suitable for hydrofluoric acid etching processes.
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