EMP110 W LED has been formulated specifically to have the strong white colour and very low colour change during high temperature processing required for LED PCBs.
Brilliant White Coating with High Blocking Power.
Non Yellowing – High Resistance to Thermal and UV Ageing.
Rapid Tack Dry for Use on High Heat-sink Substrates (IMS).
Screen Print and Spray Versions.
Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
EMP110 DI is the next generation in LPI Soldermask for Direct Imaging. It is suitable for high-reliability, HDI PCB production where ultimate resolution and registration is required.
Optimised radiation curing characteristics deliver high levels of through-cure and resolution at low energy levels without compromise in surface tack or chemical resistance.
Suitable for Laser and LED Direct Image Systems.
Versions available for 355nm up to 405nm light sources.
Low Exposure Energy (down to 50-80 mJcm-2).
Fine Solder-dam Resolution (50µm, 2mil).
High Chemical Resistance to ENIG & Sn Processes.
Screen-print and Spray.
Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
EMP110 HD is a next generation, high performance photoimageable soldermask designed to meet the exacting needs of HDI PCBs without compromise in process window, environmental compliance or material safety.
The EMP110 HD range has been engineered to deliver straight sidewalls and fine solder-dam resolution over the wide range of coating thicknesses associated with screen-printed, curtain-coated or sprayed PCBs.
Excellent through exposure for reliable sub 50 micron (2 mil) solder-dams.
Excellent chemical resistance to EING and Tin finishes.
Fully compatible with Lead-Free high temperature processes.
Universal paste with coloured hardeners for reduced inventory.
Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
EMP110 was one of the first aqueous photoimageable soldermasks on the market.
Originally developed at our UK Laboratory in 1987, EMP110 has been optimised and fine-tuned by our chemists for almost 30 years.
With a long track record and extensive OEM approvals, EMP110 is a high performance soldermask delivering reliability, confidence and consistency.
Wide range of colours, finishes and application methods.
Compatibility with Pb-free processes.
High resistance to ENIG and Sn surface finishes.
High yields and low cost-in-use.
RoHS compliant.
EM75 is a single component, solvent-free, epoxy system designed for plugging blind or buried via holes. Rheological characteristics are optimised to allow effective plugging of holes up to 0.8mm in diameter.
The 100% solids composition prevents shrinkage or voiding of the finished via plug.
EM60 Series is a high definition, 2-component soldermask based on modern epoxy technology noted for its extremely fast cure speed and superior chemical/electrical resistance. It is formulated to withstand the hardest environmental conditions.
Optimised thixotropy gives excellent print definition.
Resin systems have been carefully selected to give no bleed, even during racking of panels.
Fast curing to give an exceptionally hard and resistant coating.
Available in a range of colours and finishes.
NO aromatic amines. Contains no DDM/MDA
EM55 Peelables are formulated to provide temporary protection for selected areas against hot air solder levelling and wave soldering. They are also used for protection during certain plating processes.
EM55 is an extremely cost effective alternative to the process of masking board areas by tape against unwanted solder pickup or galvanic deposit.
EM55 is formulated to resist multiple soldering operations/heat processes typically seen during SMD-mixed assembly, without excessive hardening and poor removal from the laminate surface, connection holes or between keypad fingers.
EM55/5296 Blue is specifically formulated to permit low temperature curing down to 120ºC
High resistance to lead-free processes (>10s at 275ºC without residue or breakdown).
100% Solids, solvent free system.
High elasticity and tear strength before and after multiple heat cycles.
ELV13 UV curable legend inks are a range of high definition, strong contrast, single component UV curing inks for use in board marking and component reference.
Once fully cured they exhibit excellent resistance to no clean fluxes and industrial solvents.
Screen-print characteristics are developed and controlled using computerized rheology equipment, which ensures consistent, high-speed printing to extremely tight tolerances.
100% solids means there is no solvent to evaporate, ELV13 will not dry in the screen, allowing continuous long runs and the elimination of mid-shift clean-ups.
Good adhesion. ELV13 is formulated to give excellent adhesion to paper/phenolic, paper/epoxy and glass/epoxy substrates plus most soldermask surfaces.
ELP112 is a high contrast, high resolution photoimageable legend ink formulated for use where the required print accuracy cannot be achieved with conventional screen-printed ink or where the number of panels in the batch does not warrant the cost of making a screen and stencil.
Wide range of colours, finishes and application methods.
Compatibility with Pb-free processes.
High resistance to ENIG and Sn surface finishes.
High yields and low cost-in-use.
RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
Meets requirements of NASA outgassing and ASTM-E595.
ELECTRAJET® ETJ24
Inkjet Etch Resist
ELECTTRAJET® ETJ24 is a single-component UV set, thermal cure inkjet etch resist suitable for rigid and flex applications.
ELECTRAJET® ELJ110
Inkjet Legend Ink
ELECTRAJET® ELJ11 is a single-component UV set, thermal cure inkjet legend ink for PCB manufacture.
Strong bright white colour
Fast curing with LED lamps (385 or 395nm)
Excellent jetting performance with industrial piezo print heads
Low levels of yellowing during soldering cycles
No cracking or brittleness during multiple heat or solder cycles
Excellent adhesion to semi-cured and fully-cured soldermask
Contains no halogenated flame retardants.
Complies with RohS directives & REACH compliant
ELECTRAJET® EMJ110
Inkjet Soldermask
ELECTRAJET® EMJ110 is a high performance, high reliability soldermask specifically designed for application by inkjet.
Using over 35 years experience in developing and supporting soldermask products, Electra has rigorously formulated EMJ110 to meet or exceed industrial standards and PCB manufacturing process demands.
SM840 and UL V-0 approved
High resistance to ENIG, Tin and lead-free processes
Meets Hella G3 and exceeds Bosch TC8 automotive reliability standards
Suitable for rigid & flexible substrates
Optimised ink characteristics for sharp printing and excellent cosmetics
Wide jetting window to maximise print strategy options
Universal product suitable for a range of print heads including Konica Minolta 1024i Series and Dimatix Samba
Fully additive process with substantial environmental improvements in energy usage and VOC emissions
Halogen-free, Complies with RohS directives & REACH compliant
Electrabond is a single component, solvent-free, silver-filled, epoxy curing system designed for use as a die attach adhesive.
Electrabond viscosity and rheological characteristics are optimised for effective, fast dispensing without stringing, tailing or resin bleed. The solvent-free formulation reduces weight loss and eliminates the risk of voids
EL16 is a 2-component epoxy legend ink system for marking printed circuit boards. It is extremely fast curing and offers strong contrast, high definition and good chemical resistance.
EL16 LV has a long mixed pot-life remaining usable for up to 5 days (hardener dependant)
EL16 LV has excellent screen stability.
Excellent adhesion to soldermask, copper and bare laminate substrates.
2-component epoxy chemistry meets the formulation criteria of the AA-56032 specification.
EL11 is a high definition, high contrast, 1-Pack legend system. It is completely VOC free, waterborne system
with a low inoffensive odour. It has a long open screen life and fast cure times in both convection ovens and
infra-red tunnels. After final cure the system gives excellent adhesion to base laminate, the complete Electra
soldermask range, and most other soldermasks on the market, including dry-film. It has excellent resistance to
most industrial solvents and processing chemicals.
EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.
Excellent flexibility.
Fine solder-dam resolution (50?m, 2mil).
Resistant to multiple soldering operations.
Resistance to Pb-Free, ENIG & Sn Processes.
RoHS compliant and Halogen-Free.
RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.
Excellent flexibility.
Fine solder-dam resolution (50µm, 2mil).
Resistant to multiple soldering operations.
Resistance to Pb-Free, ENIG & Sn Processes.
RoHS compliant and Halogen-Free.
RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
ED9000 series of thermoplastic flexible resistor pastes are manufactured to a wide range of resistance values from 100 to 1Meg? per square sheet resistance and are available in custom blends. They are suitable for producing both fixed (discrete) and variable (potentiometers) resistors on polyester, polyimide, polycarbonate or ABS substrates and are particularly suitable in applications where stability must be achieved in conjunction with minimum cure temperature.