ED8080 Capacitor Dielectrics formulated to give high dielectric constants (Dk >50) for use in capacitor applications in flex and multilayer circuits.
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ED8000 Series Dielectric & Capacitor Pastes
ED8000 Dielectrics are a range of insulating and capacitor pastes.
The range has products which are suitable for use on rigid, polyester, polyimide, polycarbonate or ABS substrates and are available for thermal and UV cure versions.
The series includes ED8080 Capacitor Dielectrics formulated to give high dielectric constants (Dk >50) for use in capacitor applications in flex and multilayer circuits.
ED7500 Thermal Carbon Resistor Paste for Rigid Substrate
ED7500 carbon resistor pastes are manufactured to a wide range of resistance values from 0.25 to 1Meg? per square sheet resistance and are available in custom blends. They are suitable for high reliability fixed (discrete) and variable (potentiometers) resistors and are extensively used in high volume, safety critical automotive, military and aerospace applications.
ED7500 is widely specified and approved by OEMs.
ED7100 Thermal Carbon Resistor Paste for Rigid Substrate
ED7100 carbon resistor pastes are manufactured to a wide range of resistance values. They are suitable for producing both fixed (discrete) and variable (potentiometers) resistors and are used in both commercial and automotive applications. They are suitable for use on FR4 material, particularly in applications where temperature stability must be achieved in conjunction with minimum cure temperature.
ED5500 Thermal Carbon Conductor Paste for Rigid Substrate
ED5500 is a range of carbon and silver/carbon conductive pastes for use on PCBs and printed electronics. They are designed for high reliability applications were protection of metal contacts or printing of conductive tracks is required.
ED5500 is available in a range of resistance values from 0.25 to 20? per square sheet resistance and have a contact resistance as low as 50 milliOhms.
ED5500 is widely specified and approved by OEMs.
ED5020 Thermal Carbon Conductor Paste for Rigid Substrate
The first of their kind on the market in 1984, ED5000 series of carbon inks have been used in high volume production of consumer electronics and telecommunications for over 30 years.
ED5020 is a low resistance (<20? per square sheet resistance and 3? contact resistance), screen-printable conductive paste designed for the protection of copper contacts or printing of conductive tracks. It is intended to eliminate the costs associated with selective nickel/gold electroplating whilst maintaining a corrosion free conductive surface. They are also used for printing crossover jumpers on PCBs as an alternative to through-hole plating.
ED4000 Thermal Cure Carbon Paste for Flex Substrate
ED4000 Flexible carbon pastes are highly flexible, graphite filled thermoplastic conductive materials developed specifically for use on untreated polyester, polyimide and polycarbonate films. With their high conductivity (40? per square sheet resistance and 3? contact resistance), ED4000 products are perfectly suited for flexible circuit, membrane switch and other printed electronics applications.
ED3000 Thermal Cure Silver Paste for Flex Substrate
ED3000 Flexible silver pastes are highly flexible, thermoplastic conductive materials developed specifically for use on untreated polyester, polyimide and polycarbonate films.
With their high conductivity (30 m? per square), ED3000 products are perfectly suited for flexible circuit, membrane switch and other printed electronics applications.
ED2075 Thermal Cure Conductive Hole-plugging ink
ED2075 is a single component, solvent-free, silver-filled, epoxy system designed for plugging blind or buried via holes with or without through-hole-plating.
Rheological characteristics are optimised to allow effective plugging of aspect ratios up to 6:1.
The 100% solids composition prevents shrinkage or voiding of the finished via plug.
ED2000 Thermal Cure Silver Paste for Rigid Substrate
ED2000 series of silver pastes are highly conductive (35 milliOhms per square), silver-filled, thermosetting conductor materials suitable for use on rigid substrate. They can be used for printing through-hole, complete circuits or providing “jumper” connections on conventional circuits where high conductivity is required. They have a hard wearing surface suitable for use as sliding contacts.
Durashield V42 2-Pack Epoxy Soldermask
Durashield V 42 Mask is a low VOC, thermally-curable soldermask. It is designed to act as the soldermask finish on all types of PCB including the thick copper circuitry often used within the automotive industry.
2-pack epoxy chemistry gives excellent adhesion to bare copper & epoxy-based surfaces.
Excellent print definition through a wide variety of screen meshes.
Hard surface at elevated temperatures and high resistance to surface damage.
Excellent resistance to all multiple soldering processes including lead free.
Long pot-file of at least 48 hours at 20°C.
Increased screen stability prevents mid-shift wash-ups or staining of screen mesh.
Coatings may be cured using convection or infrared heat sources.
Meets IEC 68-2-38 Z/AD composite temperature/humidity cyclic test on 400um copper PCBs.
Durashield V42 Filler Heavy Copper Dielectric Paste
Durashield V42 Filler is a UV-sensitive dielectric material designed as a deep trench, insulating filler for thick copper (400 micron, 12 Oz) PCBs. The product is a 2-pack system for mixing prior to use.
Rapid through-cure for high through-put production.
Crack resistant, flexible film allow post cure punching and drilling.
Adhesion to copper, epoxy and resin-interlayer substrates.
Thermal shock & solder resistance to high temperature Pb-free processing.
Meets IEC 68-2-38 Z/AD composite temperature/humidity cyclic test on 400um copper PCBs.
Durashield V42 Monofiller Heavy Copper Dielectric Paste
Durashield V42 Monofiller is a UV-sensitive dielectric material designed as a deep trench, insulating filler for thick copper (400 micron, 12 oz) PCBs. The product is a pre-mixed, single-pack system. and has been used in high volume manufacture of automotive PCBs for many years with over 20 million square feet produced and in the field.
Rapid through-cure for high through-put production.
Crack resistant, flexible film allow post cure punching and drilling.
Adhesion to copper, epoxy and resin-interlayer substrates.
Thermal shock & solder resistance to high temperature Pb-free processing.
Meets IEC 68-2-38 Z/AD composite temperature/humidity cyclic test on 400um copper PCBs.
Durashield V42 LED Mask 2-Pack Epoxy Soldermask
Durashield V42 LED Mask has been formulated specifically to have the strong white colour and very low colour change during high temperature processing required for LED PCBs.
Brilliant White Coating with High Blocking Power.
Non Yellowing – High Resistance to Thermal and UV Ageing.
Screen Print and Spray Versions.
RoHS and fully REACH compliant with no TGIC or other SVHC content.
EMP110 DI – Universal Direct Image Soldermask
The EMP110 DI formulation has been engineered to deliver straight sidewalls and fine solder-dam resolution over the wide range of coating thicknesses associated with screen-printed and sprayed PCBs.
Optimised radiation curing characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.
• Low exposure energy (100-250 mJcm-2) to resolve small features sizes (light source wavelength dependant)
• No surface damage or erosion during developing
• Fine solder-dam resolution (50m, 2mil)
• Suitable for DI (single, dual and multi-wavelength) and conventional exposure systems
• High Resistance to Pb-Free, ENIG & Sn Processes
• Meets ASTM-E-595 Soldermask Outgassing requirements.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
• Available for screen-print and spray application methods
• Available in variety of colours (supplied as universal Part A and coloured Part B)
Ronascreen 1400 Series UV Curable Etch Resist
Ronascreen 1400 etch resists are formulated to resist attack by acidic and ammoniacal etchants up to pH 9.5. Ronascreen 1400 is rapidly stripped by dilute sodium hydroxide and the resulting solution does not block filters or interfere with the operation of re-cycling systems.
• Cured films are easily stripped into fine particles by a range of inorganic and organic bases.
• Fast, low energy curing gives a dry surface permitting PCBs to be stacked without “blocking”.
• Strong colour gives good contrast against the metallic substrates for easy inspection.
• A range of viscosity and thixotropic index values are available to suit all printing requirements.