WLP60 Photodielectric & Soldermask

Description:

WLP60 is a liquid, photoimageable two component photodielectric/soldermask designed for use on high definition CSP/WLP Packages. It has a long track record of use in WLP applications where final components must pass stringent High Temperature Storage (2000 hours at 150°C), Thermal Cycling (1000 cycles -40°C to 125°C) and Moisture Sensitivity (2000 hours 85°C/85% RH) tests. Versions are available for application by screen printing and spin-coat.

• Excellent resolution and side-wall profile control.
• Compatible with lead-free processing.
• Suitable for electrolytic/electroless gold plating.
• Thermal cycling & crack resistance.
• Suitable for high temperature storage.
• 12 month shelf-life.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.