WLP SH32-1-1 Photodielectric

Description:

WLP SH32-1-1 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 – 40um.

• Fast exposing – less than 250mJ/cm2 for sub-10um layers.
• Resolution capability down to 15 um line and space.
• Optimum properties achieved by low temperature 150°C cure.
• Processed by non-proprietary aqueous chemistry.
• Ambient storage, 12 month shelf life.

Technical Data Sheet:

WLP SH32-1-1
File size:978 KB
File type:PDF
Click to download:Download
WLP SH32/1/1 PART A - SDS10804
Max file size:245 KB
File type:PDF
WLP SH32/1/1 PART B - SDS10918
Max file size:297 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com