WLP SH32-1-1 Photodielectric


WLP SH32-1-1 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 – 40um.

• Fast exposing – less than 250mJ/cm2 for sub-10um layers.
• Resolution capability down to 15 um line and space.
• Optimum properties achieved by low temperature 150°C cure.
• Processed by non-proprietary aqueous chemistry.
• Ambient storage, 12 month shelf life.

Technical Data Sheet:

WLP SH32-1-1
File size:978 KB
File type:PDF
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