WLP SH32-1-1 Photodielectric
Description:
WLP SH32-1-1 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 40um.
Fast exposing less than 250mJ/cm2 for sub-10um layers.
Resolution capability down to 15 um line and space.
Optimum properties achieved by low temperature 150°C cure.
Processed by non-proprietary aqueous chemistry.
Ambient storage, 12 month shelf life.
- WLP SH32/1/1 PART A - SDS10804
- Max file size:245 KB
- File type:PDF
- WLP SH32/1/1 PART B - SDS10918
- Max file size:297 KB
- File type:PDF
To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com