WLP 4478 Photodielectric


WLP 4478 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 – 40um.

Fast exposing – less than 250mJ/cm2 for sub-10um layers.
Resolution capability down to 15 um line and space.
Optimum properties achieved by low temperature 150°C cure.
Processed by non-proprietary aqueous chemistry.
Ambient storage, 12 month shelf life.

Technical Data Sheet:

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