WLP 4478 Photodielectric
WLP 4478 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 40um.
Fast exposing less than 250mJ/cm2 for sub-10um layers.
Resolution capability down to 15 um line and space.
Optimum properties achieved by low temperature 150°C cure.
Processed by non-proprietary aqueous chemistry.
Ambient storage, 12 month shelf life.
Technical Data Sheet:
- File size:203 KB
- File type:PDF