EMP110 DI – Universal Direct Image Soldermask


The EMP110 DI formulation has been engineered to deliver straight sidewalls and fine solder-dam resolution over the wide range of coating thicknesses associated with screen-printed and sprayed PCBs.
Optimised radiation curing characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Low exposure energy (100-250 mJcm-2) to resolve small features sizes (light source wavelength dependant)
• No surface damage or erosion during developing
• Fine solder-dam resolution (50m, 2mil)
• Suitable for DI (single, dual and multi-wavelength) and conventional exposure systems
• High Resistance to Pb-Free, ENIG & Sn Processes
• Meets ASTM-E-595 Soldermask Outgassing requirements.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
• Available for screen-print and spray application methods
• Available in variety of colours (supplied as universal Part A and coloured Part B)

Technical Data Sheet:

EMP110 DI (universal)
File size: B
File type:PDF
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