EMP110 DI Direct Image Photoimageable Soldermask

Description:

EMP110 DI is the next generation in LPI Soldermask for Direct Imaging. It is suitable for high-reliability, HDI PCB production where ultimate resolution and registration is required.
Optimised radiation curing characteristics deliver high levels of through-cure and resolution at low energy levels without compromise in surface tack or chemical resistance.

• Suitable for Laser and LED Direct Image Systems.
• Versions available for 355nm up to 405nm light sources.
• Low Exposure Energy (down to 50-80 mJcm-2).
• Fine Solder-dam Resolution (50µm, 2mil).
• High Chemical Resistance to ENIG & Sn Processes.
• Screen-print and Spray.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.