EFP140 LDI Direct Image Photoimageable Soldermask


EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50?m, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.

Technical Data Sheet:

File size:471 KB
File type:PDF
Click to download:Download
EFP140/5644 G LDI - SDS20285
Max file size:149 KB
File type:PDF
EFP140/5745 T AS DI - SDS20393
Max file size:143 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com