ED2075 Thermal Cure Conductive Hole-plugging ink


ED2075 is a single component, solvent-free, silver-filled, epoxy system designed for plugging blind or buried via holes with or without through-hole-plating.
Rheological characteristics are optimised to allow effective plugging of aspect ratios up to 6:1.
The 100% solids composition prevents shrinkage or voiding of the finished via plug.

Technical Data Sheet:

File size:167 KB
File type:PDF
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ED2075 - SDS10992
Max file size:211 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com