ED2000 Thermal Cure Silver Paste for Rigid Substrate


ED2000 series of silver pastes are highly conductive (35 milliOhms per square), silver-filled, thermosetting conductor materials suitable for use on rigid substrate. They can be used for printing through-hole, complete circuits or providing “jumper” connections on conventional circuits where high conductivity is required. They have a hard wearing surface suitable for use as sliding contacts.

Technical Data Sheet:

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