ED2000 Thermal Cure Silver Paste for Rigid Substrate


ED2000 series of silver pastes are highly conductive (35 milliOhms per square), silver-filled, thermosetting conductor materials suitable for use on rigid substrate. They can be used for printing through-hole, complete circuits or providing “jumper” connections on conventional circuits where high conductivity is required. They have a hard wearing surface suitable for use as sliding contacts.

Technical Data Sheet:

File size:113 KB
File type:PDF
Click to download:Download
ED2000/3167 - SDS10515
Max file size:143 KB
File type:PDF
ED2000 - SDS10474
Max file size:142 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com