Description:

Electrabond is a single component, solvent-free, silver-filled, epoxy curing system designed for use as a die attach adhesive.
Electrabond viscosity and rheological characteristics are optimised for effective, fast dispensing without stringing, tailing or resin bleed. The solvent-free formulation reduces weight loss and eliminates the risk of voids

Technical Data Sheet:

Electrabond
File size:133 KB
File type:PDF
Click to download:Download
Electrabond 3 - SDS10442
Max file size:178 KB
File type:PDF

To discuss your requirements, place an order or if you have any product related questions please contact us on +44(0)1732 811118 or email us at info@electrapolymers.com