ED2000 series of silver pastes are highly conductive (35 milliOhms per square), silver-filled, thermosetting conductor materials suitable for use on rigid substrate. They can be used for printing through-hole, complete circuits or providing “jumper” connections on conventional circuits where high conductivity is required. They have a hard wearing surface suitable for use as sliding contacts.
ED2075 is a single component, solvent-free, silver-filled, epoxy system designed for plugging blind or buried via holes with or without through-hole-plating.
Rheological characteristics are optimised to allow effective plugging of aspect ratios up to 6:1.
The 100% solids composition prevents shrinkage or voiding of the finished via plug.
ED3000 Flexible silver pastes are highly flexible, thermoplastic conductive materials developed specifically for use on untreated polyester, polyimide and polycarbonate films.
With their high conductivity (30 m? per square), ED3000 products are perfectly suited for flexible circuit, membrane switch and other printed electronics applications.
ELX30 is a conductive silver based paste optimised for use in the construction of electro luminescent (EL) lamps
ELX30 is a conductive silver based paste optimised for use in the construction of electro luminescent (EL) lamps
