EFP140 LDI Direct Image Photoimageable Soldermask

Description:

EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50?m, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.

Technical Data Sheet:

EFP140 LDI
File size:471 KB
File type:PDF
Click to download:Download

EFP140 Photoimageable Soldermask

Description:

EFP140 is a liquid photoimageable soldermask, which has been formulated for use in the manufacture of flexible, flex-rigid PCBs and BGA packages using polyimide substrates.
Optimised exposure characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Excellent flexibility.
• Fine solder-dam resolution (50µm, 2mil).
• Resistant to multiple soldering operations.
• Resistance to Pb-Free, ENIG & Sn Processes.
• RoHS compliant and Halogen-Free.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.

Technical Data Sheet:

EFP140
File size:219 KB
File type:PDF
Click to download:Download

ELP112 Photoimageable Legend Ink

Description:

ELP112 is a high contrast, high resolution photoimageable legend ink formulated for use where the required print accuracy cannot be achieved with conventional screen-printed ink or where the number of panels in the batch does not warrant the cost of making a screen and stencil.

• Wide range of colours, finishes and application methods.
• Compatibility with Pb-free processes.
• High resistance to ENIG and Sn surface finishes.
• High yields and low cost-in-use.
• RoHS and fully REACH compliant versions with no TGIC or other SVHC content.
• Meets requirements of NASA outgassing and ASTM-E595.

Technical Data Sheet:

ELP112
File size:255 KB
File type:PDF
Click to download:Download

EMP110 DI – Universal Direct Image Soldermask

Description:

The EMP110 DI formulation has been engineered to deliver straight sidewalls and fine solder-dam resolution over the wide range of coating thicknesses associated with screen-printed and sprayed PCBs.
Optimised radiation curing characteristics deliver high levels of through-cure at low energy levels without compromise in surface hardness or chemical resistance.

• Low exposure energy (100-250 mJcm-2) to resolve small features sizes (light source wavelength dependant)
• No surface damage or erosion during developing
• Fine solder-dam resolution (50m, 2mil)
• Suitable for DI (single, dual and multi-wavelength) and conventional exposure systems
• High Resistance to Pb-Free, ENIG & Sn Processes
• Meets ASTM-E-595 Soldermask Outgassing requirements.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.
• Available for screen-print and spray application methods
• Available in variety of colours (supplied as universal Part A and coloured Part B)

Technical Data Sheet:

EMP110 DI (universal)
File size: B
File type:PDF
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EMP110 HD High Definition Photoimageable Soldermask

Description:

EMP110 HD is a next generation, high performance photoimageable soldermask designed to meet the exacting needs of HDI PCBs without compromise in process window, environmental compliance or material safety.

The EMP110 HD range has been engineered to deliver straight sidewalls and fine solder-dam resolution over the wide range of coating thicknesses associated with screen-printed, curtain-coated or sprayed PCBs.

• Excellent through exposure for reliable sub 50 micron (2 mil) solder-dams.
• Excellent chemical resistance to EING and Tin finishes.
• Fully compatible with Lead-Free high temperature processes.
• Universal paste with coloured hardeners for reduced inventory.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.

Technical Data Sheet:

EMP110 HD
File size:360 KB
File type:PDF
Click to download:Download

EMP110 Photoimageable Soldermask

Description:

EMP110 was one of the first aqueous photoimageable soldermasks on the market.
Originally developed at our UK Laboratory in 1987, EMP110 has been optimised and fine-tuned by our chemists for almost 30 years.
With a long track record and extensive OEM approvals, EMP110 is a high performance soldermask delivering reliability, confidence and consistency.

• Wide range of colours, finishes and application methods.
• Compatibility with Pb-free processes.
• High resistance to ENIG and Sn surface finishes.
• High yields and low cost-in-use.
• RoHS compliant.

Technical Data Sheet:

EMP110
File size:480 KB
File type:PDF
Click to download:Download

EMP110 W LED High White Photoimageable Soldermask

Description:

EMP110 W LED has been formulated specifically to have the strong white colour and very low colour change during high temperature processing required for LED PCBs.

• Brilliant White Coating with High Blocking Power.
• Non Yellowing – High Resistance to Thermal and UV Ageing.
• Rapid Tack Dry for Use on High Heat-sink Substrates (IMS).
• Screen Print and Spray Versions.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.

Technical Data Sheet:

EMP110 W-LED
File size:384 KB
File type:PDF
Click to download:Download