EP3912/EP2793 Combination Passivation & Plate Resist

Description:

EP3912 forms a high humidity and high temperature resistant coating. It offers protection against metal plating processes and subsequent Pb-free assembly of the final package.
It can be applied by screen-printing although formulations for other application methods (air-spray and spin-coat) are available.
EP3912 It is normally used as a barrier layer underneath the solvent soluble, photo-definable die-passivator, EP2793.

Technical Data Sheet:

EP3912/EP2793 Combination Passivation & Plate Resist
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EP3912/EP2793 Combination Passivation & Plate Resist

Description:

EP3912 forms a high humidity and high temperature resistant coating. It offers protection against metal plating processes and subsequent Pb-free assembly of the final package.
It can be applied by screen-printing although formulations for other application methods (air-spray and spin-coat) are available.
EP3912 It is normally used as a barrier layer underneath the solvent soluble, photo-definable die-passivator, EP2793.

Technical Data Sheet:

EP3912 - EP2793LV combination
File size:168 KB
File type:PDF
Click to download:Download

WLP 4478 Photodielectric

Description:

WLP 4478 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 – 40um.

Fast exposing – less than 250mJ/cm2 for sub-10um layers.
Resolution capability down to 15 um line and space.
Optimum properties achieved by low temperature 150°C cure.
Processed by non-proprietary aqueous chemistry.
Ambient storage, 12 month shelf life.

Technical Data Sheet:

WLP4478
File size:203 KB
File type:PDF
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WLP SH32-1-1 Photodielectric

Description:

WLP SH32-1-1 is a low temperature cure, i-line liquid photodielectric designed for wafer-level packaging applications. The product may be spin-coated or ultrasonically sprayed onto glass and silicon wafers at thicknesses ranging from 5 – 40um.

• Fast exposing – less than 250mJ/cm2 for sub-10um layers.
• Resolution capability down to 15 um line and space.
• Optimum properties achieved by low temperature 150°C cure.
• Processed by non-proprietary aqueous chemistry.
• Ambient storage, 12 month shelf life.

Technical Data Sheet:

WLP SH32-1-1
File size:978 KB
File type:PDF
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WLP60 Photodielectric & Soldermask

Description:

WLP60 is a liquid, photoimageable two component photodielectric/soldermask designed for use on high definition CSP/WLP Packages. It has a long track record of use in WLP applications where final components must pass stringent High Temperature Storage (2000 hours at 150°C), Thermal Cycling (1000 cycles -40°C to 125°C) and Moisture Sensitivity (2000 hours 85°C/85% RH) tests. Versions are available for application by screen printing and spin-coat.

• Excellent resolution and side-wall profile control.
• Compatible with lead-free processing.
• Suitable for electrolytic/electroless gold plating.
• Thermal cycling & crack resistance.
• Suitable for high temperature storage.
• 12 month shelf-life.
• Halogen-free, RoHS and fully REACH compliant with no TGIC or other SVHC content.

Technical Data Sheet:

WLP60 Photodielectric-Soldermask
File size:188 KB
File type:PDF
Click to download:Download